Thermoelectric Cooling Solutions

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Thermoelectronic Sub-Mounts

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Butterfly Pacage Optimal Solutions

DESCRIPTIONS

  • The package is specialized for Telecom applications.
  • The base material can be various: Kovar, CRS, CuW, CuMo.
  • The number of pins is usually 7 (one-side) or 14 (double-side).
  • The pinouts can be glass-sealed or ceramics.

SOLUTIONS WITH TE MODULES

  • Solutions with powerful single-stage TE modules are possible.
  • The sub-mount base thermal resistance is relatively small.
  • Strong reliability according to Telcordia GR-468 is required.

The Series of Butterfly Package Sub-Mounts consists of the following types with single and multi-stage TE modules:

Single-Stage Al2O3 TE Modules Single-Stage AlN TE Modules Single-Stage AlN thin TE Modules

SPECIFICATIONS

Butterfly Mounted TEC Type DTmax
K
Qmax
W
Imax
A
Umax
V
Rt
K/W
A
mm
B
mm
H
mm
DataSheet
1ML06-017-05 69 3.78 3.0 2.10 0.14 6.0 6.0 1.7 BTF14. 1ML06017
1ML06-017-09 71 2.23 1.8 2.1
1ML06-017-12 71 1.71 1.3 2.4
1ML06-023-05 69 5.11 3.0 2.80 0.11 6.0 8.2 1.7 BTF14. 1ML06023
1ML06-023-09 71 3.02 1.8 2.1
1ML06-023-12 72 2.31 1.3 2.4
1ML06-029-05 69 6.44 3.0 3.60 0.09 6.0 10.2 1.7 BTF14. 1ML06029
1ML06-029-09 71 3.80 1.8 2.1
1ML06-029-12 72 2.91 1.3 2.4
1ML06-031-05 69 6.87 3.0 3.8 0.09 8.0 8.0 1.7 BTF14. 1ML06031
1ML06-031-09 71 4.06 1.8 2.1
1ML06-031-12 72 3.11 1.3 2.4
1ML06-035-05 69 7.76 3.0 4.30 0.08 6.0 12.2 1.7 BTF14. 1ML06035
1ML06-035-09 71 4.59 1.8 2.1
1ML06-035-12 72 3.51 1.3 2.4
1ML06-050-05 69 11.05 3.0 6.2 0.06 7.0 15.0 1.7 BTF14. 1ML06050
1ML06-050-09 71 6.55 1.8 2.1
1ML06-050-12 72 5.01 1.3 2.4

Note: Specifications are given at the package hot side temperature Thot=300K. The environment in the package is vacuum.


Butterfly package 14 pins, glass-to-metal style


Butterfly package 14 pins, ceramic-to-metal style


Butterfly package 8 pins, glass-to-metal style

Please contact RMT if you need other option of the package.
info@rmtltd.ru







Options

  1. Header material
    1. Base: Kovar
  2. Header finish
    1. Gold plating
    2. Ni plating
  3. TEC Mounting
    1. Soldering
      1. SnIn,Tmelt=117°C
      2. SnBi,Tmelt=138°C
      3. PbSn,Tmelt=183°C
      4. SnZn,Tmelt=199°C
    2. Epoxy gluing
  1. TEC Leads Connection
    1. Soldering SnSb, Tmelt=230°C
  2. TEC Cold Side Finish
    1. Clear ceramics
    2. Metallized
      1. Ni / Sn(Bi)
      2. Gold plating
    3. Metallized and pre-tinned
      1. PbSnBi, Tmelt=94°C
      2. InSn, Tmelt=117°C
      3. SnBi,Tmelt=138°C
      4. PbSn, Tmelt=183°C
  1. Thermistor (optional)
    1. RMT's TB Type NTC Thermistor
    2. Resistance nominal on request
    3. Individual calibration is available in the range (-65..+85°C)
  2. Thermistor Mounting
    1. Epoxy gluing
  3. Thermistor Leads Connection
    1. Soldering SnSb, Tmelt=230°C

At the page you see only samples of optimal solutions.
On custom demands we advise solutions for various optional and special packages.
Contact us at info@rmtltd.ru

Information furnished by RMT Ltd is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change whithout notice.