Thermoelectric Cooling Solutions

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Thermoelectronic Modules

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MD04 Series of Single & Multistage TE Modules

MD04

The feature of this series of miniature TE modules is an increased cooling capacity (up to 25 W/cm2). Modules of the series are suitable for applications where it is required to remove heat from miniature objects with high power dissipation.

The MD04 is sub-series of the large MD series of TE micro-modules. It consists of miniature TECs from single- to multistage types (1MD04, 2MD04 and 3&4MD04).

The MD04 series has been designed for cooling and thermostabilization of optoelectronic devices, IR instruments and microelectronic components.

Optional design of MD04 type mini-TECs is available on request.

1MD04 Single stage Modules

The 1MD04 sub-series of single stage TE modules consists of the following types:

1MD04-003 1MD04-011 1MD04-049
1MD04-004 1MD04-017 1MD04-071
1MD04-005 1MD04-023 1MD04-097
1MD04-007 1MD04-031 1MD04-127

Specifications

1MD04 Type DTmax
K
Qmax
W
Imax
A
Umax
V
AC R
Ohm
H
mm
A
mm
B
mm
C
mm
D
mm
Data Sheet
1MD04-003-xx (N=3)
1MD04-003-05 70 0.31 1.6 0.35 0.19 1.1 1.2 1.9 1.2 2.6 1MD04003
1MD04-003-08 71 0.20 1.0 0.31 1.4
1MD04-003-10 72 0.16 0.8 0.38 1.6
1MD04-003-12 72 0.14 0.7 0.46 1.8
1MD04-003-15 72 0.11 0.55 0.57 2.1
1MD04-004-xx (N=4)
1MD04-004-05 70 0.42 1.6 0.50 0.26 1.1 2.4 1.3 2.4 2.0 1MD04004
1MD04-004-08 71 0.27 1.0 0.41 1.4
1MD04-004-10 72 0.22 0.8 0.51 1.6
1MD04-004-12 72 0.18 0.7 0.62 1.8
1MD04-004-15 72 0.15 0.55 0.77 2.1
1MD04-005-xx (N=5)
1MD04-005-05 70 0.53 1.6 0.60 0.32 1.1 1.4 3.2 1.4 3.8 1MD04005
1MD04-005-08 71 0.34 1.0 0.51 1.4
1MD04-005-10 72 0.28 0.8 0.64 1.6
1MD04-005-12 72 0.23 0.7 0.76 1.8
1MD04-005-15 72 0.18 0.55 0.95 2.1
1MD04-007-xx (N=7)
1MD04-007-05 70 0.72 1.6 0.85 0.45 1.6 2.6 2.6 2.6 2.6 1MD04007
1MD04-007-08 71 0.46 1.0 0.71 1.9
1MD04-007-10 72 0.38 0.8 0.88 2.1
1MD04-007-12 72 0.31 0.7 1.06 2.3
1MD04-007-15 72 0.26 0.55 1.32 2.6
1MD04-011-xx (N=11)
1MD04-011-05 70 1.14 1.6 1.35 0.72 1.6 3.2 3.2 3.2 3.2 1MD04011
1MD04-011-08 71 0.74 1.0 1.13 1.9
1MD04-011-10 72 0.60 0.8 1.41 2.1
1MD04-011-12 72 0.50 0.7 1.69 2.3
1MD04-011-15 72 0.40 0.55 2.10 2.6
1MD04-017-xx (N=17)
1MD04-017-05 70 1.75 1.6 2.10 1.08 1.6 3.8 3.8 3.8 3.8 1MD04017
1MD04-017-08 71 1.12 1.0 1.72 1.9
1MD04-017-10 72 0.91 0.8 2.14 2.1
1MD04-017-12 72 0.79 0.7 2.58 2.3
1MD04-017-15 72 0.62 0.55 3.21 2.6
1MD04-023-xx (N=23)
1MD04-023-05 70 2.36 1.6 2.85 1.51 1.6 4.4 4.4 4.4 4.4 1MD04023
1MD04-023-08 71 1.53 1.0 2.38 1.9
1MD04-023-10 72 1.24 0.8 2.95 2.1
1MD04-023-12 72 1.04 0.7 3.53 2.3
1MD04-023-15 72 0.84 0.55 4.40 2.6
1MD04-031-xx (N=31)
1MD04-031-05 70 3.16 1.6 3.80 1.97 1.6 5.0 5.0 5.0 5.0 1MD04031
1MD04-031-08 71 2.03 1.0 3.13 1.9
1MD04-031-10 72 1.65 0.8 3.91 2.1
1MD04-031-12 72 1.38 0.7 4.68 2.3
1MD04-031-15 72 1.12 0.55 5.85 2.6
1MD04-049-xx (N=49)
1MD04-049-05 70 5.20 1.6 6.00 3.12 1.6 6.2 6.2 6.2 6.2 1MD04049
1MD04-049-08 71 3.25 1.0 4.95 1.9
1MD04-049-10 72 2.64 0.8 6.18 2.1
1MD04-049-12 72 2.21 0.7 7.40 2.3
1MD04-049-15 72 1.80 0.55 9.24 2.6
1MD04-071-xx (N=71)
1MD04-071-05 70 7.22 1.6 8.65 4.52 1.6 7.4 7.4 7.4 7.4 1MD04071
1MD04-071-08 71 4.63 1.0 7.18 1.9
1MD04-071-10 72 3.77 0.8 8.95 2.1
1MD04-071-12 72 3.16 0.7 10.7 2.3
1MD04-071-15 72 2.57 0.55 13.4 2.6
1MD04-097-xx (N=97)
1MD04-097-05 70 9.70 1.6 11.9 6.17 1.6 8.6 8.6 8.6 8.6 1MD04097
1MD04-097-08 71 6.41 1.0 9.81 1.9
1MD04-097-10 72 5.22 0.8 14.7 2.1
1MD04-097-12 72 4.37 0.7 10.7 2.3
1MD04-097-15 72 3.55 0.55 18.3 2.6
1MD04-127-xx (N=127)
1MD04-127-05 70 13.0 1.6 15.7 8.14 1.6 9.8 9.8 9.8 9.8 1MD04127
1MD04-127-08 71 8.37 1.0 12.9 1.9
1MD04-127-10 72 6.80 0.8 16.1 2.1
1MD04-127-12 72 5.70 0.7 19.3 2.3
1MD04-127-15 72 4.63 0.55 24.1 2.6

Note: Performance data shown in specifications are given for Th=300 K, vacuum.

Options

  1. TEC Assempling
    1. Solder SNSb (Tmelt=230°C)
    2. Solder PbSn (Tmelt=183°C)
  2. Ceramics
    1. Pure Alumnia 100%
    2. Alumina 96%
    3. Aluminum Nitride (AIN)
  1. Surface finish
    1. Clear ceramics
    2. Metallized Ni (Ni/Sn(Bi))
    3. Metallized Au
  2. Pretinning
    1. Rose alloy (PbSnBi, Tmelt=94°C)
    2. Solder 117 (InSn, Tmelt=117°C)
    3. Solder 138 (SnBi, Tmelt=138°C)
    4. Solder 157 (In, Tmelt=157°C)
    5. Solder 183 (PbSn, Tmelt=183°C)
    6. Solder 199 (SnZn, Tmelt=199°C)
  1. Protective coating
    1. Parylene coating (10-15 mm thickness)
  1. Thermosensor
    1. NTC Glass beaded

Information furnished by RMT Ltd is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change whithout notice.