Thermoelectric Cooling Solutions

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1ML06 Series for Telecom Applications

ML SERIES

The ML Series has been designed for Telecom applications. Optimized for WDM and laser diode packages such as "butterfly", HHL, DIL, miniDIL and others. The ML Series consists of three sub-series of the same TEC types by footprint but different by applied ceramics, thus different in height and performance:

Thermoelectric coolers on Al2O3 0.5mm ceramics

The 1ML06 Series of single stage TE modules made with Al2O3 ceramics consists of the following types:

1ML06-017 1ML06-029 1ML06-035
1ML06-023 1ML06-031 1ML06-050

SPECIFICATIONS

1ML06
Al2O3
Type DTmax
K
Qmax
W
Imax
A
Umax
V
AC R
Ohm
H
mm
A
mm
B
mm
C
mm
D
mm
Data Sheet
1ML06-017-xx (N=17, Al2O3 0.5mm ceramics)
1ML06-017-05 69 3,85 3,5 2,10 0,50 1,6 6,0 6,0 6,0 6,0 1ML06017
1ML06-017-07 70 2,90 2,4 0,67 1,8
1ML06-017-09 71 2,25 2,0 0,89 2
1ML06-017-12 71 1,70 1,5 1,15 2,3
1ML06-023-xx (N=23, Al2O3 0.5mm ceramics)
1ML06-023-05 69 5,20 3,5 2,80 0,68 1,6 6,0 8,2 6,0 8,2 1ML06023
1ML06-023-07 70 3,90 2,4 0,90 1,8
1ML06-023-09 71 3,05 2,0 1,20 2
1ML06-023-12 71 2,30 1,5 1,60 2,3
1ML06-029-xx (N=29, Al2O3 0.5mm ceramics)
1ML06-029-05 69 6,55 3,5 3,55 0,85 1,6 6,0 10,2 6,0 10,2 1ML06029
1ML06-029-07 70 4,90 2,4 1,13 1,8
1ML06-029-09 71 3,85 2,0 1,50 2
1ML06-029-12 71 2,90 1,5 2,00 2,3
1ML06-031-xx (N=31, Al2O3 0.5mm ceramics)
1ML06-031-05 69 7,00 3,5 3,80 0,91 1,6 8,0 8,0 8,0 8,0 1ML06031
1ML06-031-07 70 5,20 2,4 1,21 1,8
1ML06-031-09 71 4,10 2,0 1,60 2
1ML06-031-12 71 3,15 1,5 2,15 2,3
1ML06-035-xx (N=35, Al2O3 0.5mm ceramics)
1ML06-035-05 69 7,90 3,5 4,30 1,05 1,6 6,0 12,2 6,0 12,2 1ML06035
1ML06-035-07 70 5,90 2,4 1,37 1,8
1ML06-035-09 71 4,65 2,0 1,80 2
1ML06-035-12 71 3,55 1,5 2,40 2,3
1ML06-050-xx (N=50, Al2O3 0.5mm ceramics)
1ML06-050-05 69 11,30 3,5 6,15 1,45 1,6 7,0 15,0 7,0 15,0 1ML06050
1ML06-050-07 70 8,40 2,4 1,95 1,8
1ML06-050-09 71 6,60 2,0 2,60 2
1ML06-050-12 71 5,05 1,5 3,45 2,3

Note: Performance data shown in specifications are given for Th=300 K, vacuum.

Options

  1. TEC Assempling
    1. Solder SNSb (Tmelt=230°C)
    2. Solder PbSn (Tmelt=183°C)
  2. Ceramics
    1. Pure Alumnia 100%
    2. Alumina 96%
    3. Aluminum Nitride (AIN)
  1. Surface finish
    1. Clear ceramics
    2. Metallized Ni (Ni/Sn(Bi))
    3. Metallized Au
  2. Pretinning
    1. Rose alloy (PbSnBi, Tmelt=94°C)
    2. Solder 117 (InSn, Tmelt=117°C)
    3. Solder 138 (SnBi, Tmelt=138°C)
    4. Solder 157 (In, Tmelt=157°C)
    5. Solder 183 (PbSn, Tmelt=183°C)
    6. Solder 199 (SnZn, Tmelt=199°C)
  1. Protective coating
    1. Parylene coating (10-15 mm thickness)
  1. Thermosensor
    1. NTC Glass beaded

Information furnished by RMT Ltd is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change whithout notice.