Thermoelectric Cooling Solutions

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Thermoelectric coolers

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MD03 Series of Single & Multistage TE Modules


The MD03 Series is the special series for cooled TOSA applications. MD03 thermoelectric coolers are specially developed for cooled TOSA applications. The main advantage is in miniature size, low heigh and operating current optimized for TOSA with lower power consumption requirements.

MD03 Series has more than 100 different thermoelectric cooler types, targeted for TO-can and box-like MSA TOSA packaging standards. Al2O3 ceramics is applied by default, AlN ceramics is available as an option. RMT provides a wide range of manufacturing options, including Au-Sn solder assembly, shape and polarity customization and special Au patterns for direct mounting on TEC cold side.

All MD03 thermoelectric coolers are RoHS compliant and qualified by Telcordia GR-468 standard.

MD03 TECs are developed by RMT specially for telecom industry. MD03 thermoelectric coolers have low operating current and low power consumption. The variety of dimensions and performance parameters makes 1MD03 thermoelectric coolers the best choice for temperature stabilization in TOSA applications.

Click to enlarge. Click to enlarge. Click to enlarge.
Example 1 - TO-can 6pin TOSA header with
1MD03 Series thermoelectric cooler
Example 2 - box MSA TOSA package with
1MD03 Series thermoelectric coole
Example 3 - TO-46 Header with 1MD03
Series TE Cooler for VCSEL

Thermoelectric coolers MD03 Series
Performance table at 27C, vacuum.
Performance table at 50C, N2.


Important Note: MD03 Series TECs can be manufactured on standard 0.25mm and thick 0.5mm ceramics. This adds an additional flexibility to performance and height optimization in a particular application. It is also possible to combine various ceramics thicknesses to achieve the most optimal results for TEC height.

Please, use On-Line Assistant to find the most optimal thermoelectric cooler by dimensions and performance parameters. The detailed analysis of TEC performance and power consumption can be made with free TECCad software for Windows or special iTECPad app for iPad (available free on App Store).


  1. TEC Assempling
    1. Solder SnSb (Tmelt=230°C)
    2. Solder AuSn (Tmelt=280°C)
  2. Ceramics
    1. Pure Al2O3 (100%)
    2. Alumina Al2O3 (96%)
    3. Aluminum Nitride (AIN)
  1. Surface finish
    1. Blank ceramics (not metallized)
    2. Metallized (Au plating)
    3. Metallized and pre-tinned with:
      1. Solder 117 (InSn, Tmelt=117°C)
      2. Solder 138 (SnBi, Tmelt=138°C)
      3. Solder 143 (In-Ag, Tmelt=143°C)
      4. Solder 157 (In, Tmelt=157°C)
      5. Solder 183 (PbSn, Tmelt=183°C)
      6. Optional (specified by Customer)
  1. Thermosensor (optional)
    • Can be mounted to cold side ceramics edge. Calibration is available by request.
  2. Terminal contacts:
    1. Blank, tinned Copper
    2. Insulated Wires
    3. Insulated, color coded


Information furnished by RMT Ltd is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change whithout notice.