Thermoelectric Cooling Solutions

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Thermoelectric coolers

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MDL Series of Single & Multistage TE Modules

MDL06

MDL06 Series of thermoelectric coolers is developed for telecom applications. It is the analog of regular ML06 Series by main geometry, but MDL06 TECs have up to 100% higher cooling capacity. MDL06 TECs are based on RMT high-density pellets placement technology that allows to fit more BiTe elements on the same size as regular TEC types. Thermoelectric coolers are available on standard 0.5mm ceramics (Al2O3 or AlN) and thin 0.25mm ceramics.

All MDL06 thermoelectric coolers are RoHS compliant and qualified by Telcordia GR-468 standard. RMT improved thermoelectric material provides high performance and low power consumption in final application. The MDL06 Series has been specially designed for cooling and thermostabilization of high-power laser diodes in telecom applications.

Thermoelectric coolers from MDL06 Series are based on RMT regular assembly technology with up to 28W/cm2 cooling power density. Thermoelectric coolers may have regular wires or WB terminal connection type. RMT Ltd provide a wide range of manufacturing options for the most optimal integrating into final application. The table below contains all standard thermoelectric coolers from ML06 Series with performance values specified at +27ºC Vacuum and +50ºC Dry N2 conditions.

Hint: 1MDL06 Series thermoelectric coolers have the same dimensions as regular 1ML06 Series TECs. In fact 1MDL06 Series is the alternative choice for applications with high heatload, if it is required to reduce the power consumption or meet certain dT level. The best performance and lowest power consumption are achieved by correct TEC selection. Too powerful (in terms of cooling capacity) TEC can be less efficient under small heatload, but gives a lot with heatload increasing. The example shows the comparison between 1ML06-029-09 from regular 1ML06 Series and 1MDL06-042-09 from 1MDL06 Series. 1MDL06 TEC is more optimal at high heatload and provides a required dT level, where regular TEC is already out.

Click to enlarge.
The estimations and comparison are made with iTECPad software for iPad. Please, follow this link for more info.

Thermoelectric coolers MDL06 Series
TECs on Al2O3 0.5mm
TECs on Al2O3 0.25mm
TECs on AlN 0.5mm
TECs on AlN 0.25mm
Performance table at 27C, vacuum.
Performance table at 50C, N2.

Specifications


Important Note: ML06 Series TECs can be manufactured on standard 0.5mm and thin 0.25mm ceramics. This adds an additional flexibility to performance and height optimization in a particular application. It is also possible to combine various ceramics thicknesses to achieve the most optimal results for TEC height, performance and power consumption. Mind, please, that with different ceramics thickness TECs may have different performance having the same geometry. Here is the example (please, click to zoom in):

Click to enlarge.

Please, use On-Line Assistant to find the most optimal thermoelectric cooler by dimensions and performance parameters. The detailed analysis of TEC performance and power consumption can be made with free TECCad software for Windows or special iTECPad app for iPad (available free on App Store).


Options

  1. TEC Assempling
    1. Solder SnSb (Tmelt=230°C)
    2. Solder AuSn (Tmelt=280°C)
  2. Ceramics
    1. Pure Al2O3 (100%)
    2. Alumina Al2O3 (96%)
    3. Aluminum Nitride (AIN)
  1. Surface finish
    1. Blank ceramics (not metallized)
    2. Metallized (Au plating)
    3. Metallized and pre-tinned with:
      1. Solder 117 (InSn, Tmelt=117°C)
      2. Solder 138 (SnBi, Tmelt=138°C)
      3. Solder 143 (In-Ag, Tmelt=143°C)
      4. Solder 157 (In, Tmelt=157°C)
      5. Solder 183 (PbSn, Tmelt=183°C)
      6. Optional (specified by Customer)
  1. Thermosensor (optional)
    • Can be mounted to cold side ceramics edge. Calibration is available by request.
  2. Terminal contacts:
    1. Blank, tinned Copper
    2. Insulated Wires
    3. Insulated, color coded

Information furnished by RMT Ltd is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change whithout notice.