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MDX04 Series of Single & Multistage TE Modules


The MDX04 Series of thermoelectric coolers is based on MD04 Series high-density pellets placement and MX Group enlarged cold side concept. MDX04 Series contains 12 different 2-stage TECs with enlarged cold side. MDX04 TE coolers are developed and optimized mainly for sensing applications (X-Ray and IR). Additionally to enlarged cold ceramics MDX04 TECs have special electrical connections inside. It is a mix of serial and parallel connections between TEC internal elements that provides a unique balance for cooling capacity, dT and power consumption. Thermoelectric coolers from MDX04 group are optimal choice for X-Ray and IR- applications with large cold side required for detector elements. Thermoelectric coolers can be manufactured on regular and thin ceramics. It provides certain flexibility for TEC height variations. Al2O3 ceramics is applied by default, AlN ceramics is available as an option.

MDX04 TECs were developed by RMT separately to general thermoelectric coolers series. MDX04 TECs have quad shape with the same dimensions for hot and cold sides, different to typical pyramidal shape of multistage TE coolers. The optimal balance of parameters and additional flexibility in TEC height variations by ceramics thickness allow to replace single-stage TE coolers in sensing applications keeping the same geometry.

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Example 1 - 2MDX04-014-0816 TEC on
TO-39 header, 3x3mm2 cold side
Example 2 - 2MDX04-042-0816 TEC on
TO-66 header, 5x5mm2 cold side
Example 3 - 2MDX04-102-0816 TEC on
TO-3 header, 5x5mm2 cold side

Thermoelectric coolers MDX04 Series
Performance table at 27C, vacuum.
Performance table at 50C, N2.


Important Note: MDX04 Series TECs can be manufactured on standard 0.5mm and thin 0.25mm ceramics. This adds an additional flexibility to performance and height optimization in a particular application. It is also possible to combine various ceramics thicknesses to achieve the most optimal results for TEC height.

Please, use On-Line Assistant to find the most optimal thermoelectric cooler by dimensions and performance parameters. The detailed analysis of TEC performance and power consumption can be made with free TECCad software for Windows or special iTECPad app for iPad (available free on App Store).


  1. TEC Assempling
    1. Solder SnSb (Tmelt=230°C)
    2. Solder AuSn (Tmelt=280°C)
  2. Ceramics
    1. Pure Al2O3 (100%)
    2. Alumina Al2O3 (96%)
    3. Aluminum Nitride (AIN)
  1. Surface finish
    1. Blank ceramics (not metallized)
    2. Metallized (Au plating)
    3. Metallized and pre-tinned with:
      1. Solder 117 (InSn, Tmelt=117°C)
      2. Solder 138 (SnBi, Tmelt=138°C)
      3. Solder 143 (In-Ag, Tmelt=143°C)
      4. Solder 157 (In, Tmelt=157°C)
      5. Solder 183 (PbSn, Tmelt=183°C)
      6. Optional (specified by Customer)
  1. Thermosensor (optional)
    • Can be mounted to cold side ceramics edge. Calibration is available by request.
  2. Terminal contacts:
    1. Blank, tinned Copper
    2. Insulated Wires
    3. Insulated, color coded

Information furnished by RMT Ltd is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change whithout notice.