Thermoelectric coolers
MD015 SERIES OF SINGLE TE MODULES
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The MD015 Series consists of thermoelectric cooler based on RMT SuperHD pellets placement technology. MD015 TECs have a combination of a miniature cross section of pellets and a distance of 100 μm between them. This allows the density of 1600 elements per 1 cm2. The result is – unique miniature thermoelectric coolers with low current, low energy consumption and operating voltage, optimal for the best power supply efficiency. TE modules of the 1MD015 Series have planar dimensions less than 1,5 mm2 and height 0,55 mm and lower. MD015 TECs meet high performance requirements of transceiver components with low power consumption. MD015 Series is recommended for TO-can TOSA transceivers, VCSELs and miniature LD-applications in small form factors (TO46 and TO56 and smaller). AlN ceramics is applied by default, Al2O3 ceramics is available as an option. |
MD015 Series have the highest level of bulk thermoelectric coolers miniaturization. MD015 TECs are developed by RMT mainly for cooling and temperature stabilization of telecommunication miniature systems.
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| Fig.1 - 1x1 mm2 cold side thermoelectric cooler - the smallest one from MD015 Series | Fig.2 - 1MD015-010-025AN SEM photo. 20 BiTe pellets on 1x1.6 mm2 size |
Fig.3 - TE module 1MD015-010-03 mounted on ТО-46 header |
Thermoelectric coolers MD015 Series
SPECIFICATIONS
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Exterior |
Type |
dTmax |
Qmax |
Imax |
Umax |
ACR |
H |
A |
B |
C |
D |
DataSheet |
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Performance table at 27C, vacuum |
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1MD015-008-XX (N=8) |
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1MD015-008-025 |
67 |
0.27 |
0.45 |
1.0 |
1.77 |
0.5 |
1.0 |
1.0 |
1.0 |
1.4 |
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1MD015-008-03 |
69 |
0.22 |
0.35 |
2.12 |
0.55 |
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1MD015-010-XX (N=10) |
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1MD015-010-025 |
67 |
0.34 |
0.45 |
1.25 |
2.21 |
0.5 |
1.0 |
1.3 |
1.0 |
1.6 |
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1MD015-010-03 |
69 |
0.28 |
0.35 |
2.65 |
0.55 |
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1MD015-018-XX (N=18) |
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1MD015-018-025 |
67 |
0.60 |
0.45 |
2.3 |
3.98 |
0.5 |
1.5 |
1.5 |
1.5 |
1.9 |
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1MD015-018-03 |
69 |
0.50 |
0.35 |
4.77 |
0.55 |
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1MD015-027-XX (N=27) |
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1MD015-027-025 |
67 |
0.91 |
0.45 |
3.4 |
5.97 |
0.5 |
1.6 |
2.3 |
1.6 |
2.9 |
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1MD015-027-03 |
69 |
0.75 |
0.35 |
7.16 |
0.55 |
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1MD015-032-XX (N=32) |
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1MD015-032-025 |
66 |
1.07 |
0.45 |
4.0 |
7.08 |
0.5 |
2.0 |
2.0 |
2.0 |
2.4 |
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1MD015-032-03 |
69 |
0.89 |
0.35 |
8.48 |
0.55 |
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Performance table at 50C, N2
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1MD015-008-XX (N=8) |
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1MD015-008-025 |
72 |
0.29 |
0.45 |
1.1 |
1.99 |
0.5 |
1.0 |
1.0 |
1.0 |
1.4 |
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1MD015-008-03 |
74 |
0.24 |
0.35 |
2.39 |
0.55 |
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1MD015-010-XX (N=10) |
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1MD015-010-025 |
72 |
0.35 |
0.45 |
1.4 |
2.49 |
0.5 |
1.0 |
1.3 |
1.0 |
1.6 |
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1MD015-010-03 |
74 |
0.3 |
0.35 |
2.98 |
0.55 |
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1MD015-018-XX (N=18) |
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1MD015-018-025 |
72 |
0.66 |
0.45 |
2.5 |
4.48 |
0.5 |
1.5 |
1.5 |
1.5 |
1.9 |
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1MD015-018-03 |
74 |
0.55 |
0.35 |
5.37 |
0.55 |
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1MD015-027-XX (N=27) |
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1MD015-027-025 |
72 |
1.00 |
0.45 |
3.75 |
6.72 |
0.5 |
1.6 |
2.3 |
1.6 |
2.9 |
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1MD015-027-03 |
74 |
0.80 |
0.35 |
8.06 |
0.55 |
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1MD015-032-XX (N=32) |
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1MD015-032-025 |
72 |
1.17 |
0.42 |
4.5 |
7.97 |
0.5 |
2.0 |
2.0 |
2.0 |
2.4 |
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1MD015-032-03 |
74 |
0.98 |
0.35 |
9.55 |
0.55 |
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Please, use On-Line Assistant to find the most optimal thermoelectric cooler by dimensions and performance parameters. The detailed analysis of TEC performance and power consumption can be made with free TECCad software for Windows
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OPTIONS
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A. TEC Assembly
Solder 1. Lead-free Solder Sn-Sb (Tmelt =230ºC) – default 2. Lead-free Solder Au-Sn (Tmelt = 280ºC) available by request B. Ceramics 1. Aluminum Nitride (AIN) - default2. Al2O3 100% 3. Mixed solution (AlN/Al2O3)
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C. Surface
finish 2. Metallized (Au plating) D. Thermistor (optional) Can be mounted to TEC cold side. Calibration is available by request. Various thermistor solutions are availableE. TEC Terminal contacts: 1. WB pads or WB posts2. Flip-Chip Terminal Solution |
Information furnished by RMT Ltd is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change whithout notice.
