客制化解决方案

Ferrotec-RMT 拥有芯片贴装、引线键合以及惰性气体环境下密封封装的技术。可根据客户需求开发定制化解决方案。

At Ferrotec-RMT, we don’t just manufacture components—we solve challenges. We partner with you to develop custom Transmission Optical Sub-Assemblies (TOSAs), sensors and detectors tailored to your exact requirements.

Cooled SiPM in TO8 package — Cooled SiPM in **TO8** package

Your Vision, Our End-to-End Expertise

From prototype to high-volume production, we deliver complete solutions through our integrated capabilities:

Precision Micro-Assembly: Chip mounting with using advanced bonding techniques (flux free soldering, epoxy, conductive glue) for PD, LD, MEMS and SMD components.
Advanced Interconnection: Gold wire bonding (30, 25, 18 µm) and bonding of Pt, Cu, and other materials for reliable electrical connections in TECs, PDs and LDs.
Custom Optics: Production of lids and windows from Ge, Si, Sapphire, Beryllium, and other materials—including AR coating—for any package type.
Reliable Hermetic Sealing: Package sealing via welding, gluing or soldering in vacuum, nitrogen or argon environments.
Comprehensive Validation & Analysis: Rigorous reliability and performance testing to ensure real world readiness:
- C SAM (Sonoscan) and X ray screening for internal integrity.
- Advanced Imaging & Material Analysis: X ray Tomography, X ray Fluorescence (XRF) and Scanning Electron Microscopy (SEM).
- Environmental & Stress Testing: Mechanical shock, thermal cycling and extended environmental exposure.

From concept to certified component, Ferrotec-RMT is your dedicated partner for custom optoelectronics.

For a tailored solution for your specific application, please contact our engineering team to discuss your project.