On
customer demand thin film conductive patterns can be printed directly onto
the TEC cold side. Applications - direct mounting of laser, CCD,
photodetector chips on TE module cold side surface. Typical plating:
Gold plating, provided for wire bonding.
Ni/Sn plating for solderability
THERMOSENSOR
Mounting
of miniature NTC thermistors or other type thermosensors to a TEC cold
side is available on request. RMT recommends miniature glass-beaded
thermistors for this use.
A range of thermistors is available (resistance
nominal, TCR, dimensions).
Mounting method is thermoconductive epoxy
gluing to the cold side lateral surface or demanded placement.
On
customer demand thin film conductive patterns can be printed directly onto
the TEC cold side. Applications - direct mounting of laser, CCD,
photodetector chips on TE module cold side surface. Typical plating:
Mounting
of miniature NTC thermistors or other type thermosensors to a TEC cold
side is available on request. RMT recommends miniature glass-beaded
thermistors for this use.