Vibration and shocks are usual for most of devices where TECs are installed, particularly portable field applications, military and airspace programs. Thermoelectric modules have high durability to such dynamic loads. They have been successfully subjected to shock and vibration requirements for aircraft, spaceship, shipboard use and most other such applications many times.

To confirm high durability TECs are exposed to mechanical testing in qualification programs.

Standard mechanical testing is specified in Telcordia GR-468 CORE ((Reliability Assurance for Optoelectronic Devices).

Regular TECs must withstand the minimal following vibration and shock loads:

Note: During such mechanical testing a dummy mass imitating a cold object is to be mounted on top of TECs. For most of applications the mass is about 1-2 gram.

Important remark

Above mentioned mechanical durability is related to TEC construction. In real applications different object could be mounted onto TEC cold side. Parameters (size and weight) of cold object mounted in real application to TEC cold side will limit considerably the durability to mechanical loads.