Soldering is preferable mounting method for miniature single and multistage TECs.

Soldering is most complicated mounting method which required professional personnel and tools.

Combination of proper handling, and proper assembly techniques will yield an reliable TEC system

Thermoelectric material is strong in both tension and compression, but tends to be weak in shear

TEC is DC current semiconductor device

DC Closed Loop Temperature Control is preferable

PWM has large disadvantage for TEC control

Relay regulation gives ripples of temperature and can reduces TEC lifetime

DC Control of TEC always has advantage over PWM.

Limit the ripple factor of power supply to less than 10%

Never use TEC without heat sink

Try to exclude redundant overheating of TECs

Proper heat sink contribute to TEC efficiency

Composite materials Copper-Tungsten and  Copper-Molybdenum are preferable for TEC holders

Include gas ambient conditions in thermal management considerations

For multistage TEC cooling dry gas ambient is required or vacuum arrangement is preferable.

Deeper cooling (multistage TECs) - more negative influence of gas

Worth case - dry air, best - inert heavy gases like as xenon, krypton.