|
The efficiency of TEC depends on the quality of mounting
an object to be cooled onto TEC and the TEC onto heat rejecting
elements. There are three
widely applied methods that are used for TEC mounting:
 |
Mechanical
mounting (compression method) |
|
Soldering
|
|
Adhesive
bonding. |
Each of the listed
methods has its own areas of applications, both advantages and disadvantages.
When choosing an optimal way of mounting a TEC and cooled objects it
is necessary to be guided by features of the methods and preferable field of
applications.
Mechanical Mounting
|
Applications |
Advantages |
Disadvantages |
|
Permanent
bonding is not desired |
|
Multiple
TECs are used |
|
TECs of
large size |
|
|
Easy
mounting and dismounting procedures |
|
Low
effect of mismatching of TEC and heat sink materials TCE |
|
|
Extra
space for fixtures |
|
Heat load
from fixing parts |
|
Low
thermal conductivity |
|
Not
useful for mini TECs |
|
Limited
temperature application |
|
Soldering
|
Applications |
Advantages |
Disadvantages |
|
Miniature
TECs |
|
High-strength junction |
|
Vacuum
applications |
|
Long
operation at high temperatures |
|
|
Minimal
outgassing |
|
High
mechanical strength |
|
High
thermal conductivity |
|
Availability of mounting and dismounting |
|
|
Most
complex mounting procedure |
|
Risk of
TEC damage during procedure |
|
Not for
large size TECs |
|
Adhesive Bonding
|
Applications |
Advantages |
Disadvantages |
|
Miniature
TECs |
|
High-strength junction |
|
Minimal
mounting tools |
|
|
Easy
mounting procedure |
|
Minimal
requirements to TEC surface finish - blank ceramics |
|
|
Moderate
thermal conductance |
|
Permanent
attachment |
|
Outgassing limits vacuum use |
|
Limited
operation temperature |
|
Soldering is most preferable mounting
method for miniature single and multistage TECs.
Soldering is most complicated mounting
method which required professional personnel and tools. |
