|
TO822 PACKAGE OPTIMAL SOLUTIONS
 |
DESCRIPTIONS
 |
The package is of 0.822
inch (20.9 mm) diameter
|
|
The base material is
Kovar
|
|
Gold or Nickel
plating is available
|
|
The number of pins is up to 16 (usually 6…16) |
SOLUTIONS WITH
TE MODULES
|
The header surface open for mounting is 12 x 12 mm2
|
|
Mounting
of single- to three-stage TE modules is
possible |
|
A thermosensor (NTC thermistor) is available |
|
The Series of TO822 Package Sub-Mounts
consists of the following types with single and multi-stage TE modules:
SPECIFICATIONS
| TO822 |
Mounted TEC Type |
DTmax
K |
Qmax
W |
Imax
A |
Umax
V |
Rt
K/W |
A
mm |
B
mm |
H
mm |
Datasheet |
Note: Specifications are given at the package hot side temperature Thot=300K. The environment in the package is vacuum.
[ Up
]
[
Single-Stage TE Modules
] [ Two-Stage TE Modules ] [
Three-Stage TE Modules
][ Four-Stage TE Modules
]
TYPICAL PACKAGES
|
TO822 header with 12 pins
|
Please contact
RMT if you need other option of the package.
info@rmtltd.ru
|
|
OPTIONS
|
A. |
|
D. |
|
G. |
Thermistor (optional)
|
|
|
Kovar |
|
Soldering SnSb, Tmelt=230°C |
|
1.RMT’s TB Type NTC Thermistor |
|
B. |
|
F. |
|
|
2.Resistance nominal on request |
|
|
1.Gold plating |
|
1.Clear ceramics |
|
3.Individual
calibration is available in the range (-65..+85°C) |
|
|
2.Ni plating |
|
2.Metallized |
|
|
C. |
|
|
|
2.1 Ni / Sn(Bi) |
H. |
|
|
|
1.Soldering |
|
|
2.2 Gold plating |
|
Epoxy gluing |
|
|
|
1.1 SnIn,Tmelt=117°C |
|
3.Metallized and pre-tinned |
I. |
Thermistor Leads Connection
|
|
|
|
1.2 SnBi,Tmelt=138°C |
|
|
3.1 PbSnBi, Tmelt=94°C |
|
Soldering SnSb, Tmelt=230°C |
|
|
|
1.3 PbSn,Tmelt=183°C |
|
|
3.2 InSn, Tmelt=117°C |
|
|
|
|
|
1.4 SnZn,Tmelt=199°C |
|
|
3.3 SnBi,Tmelt=138°C |
|
|
|
|
2.Epoxy gluing |
|
|
3.4 PbSn, Tmelt=183°C |
|
|
At the page you see only samples of optimal
solutions.
On custom demands we advise solutions for various optional and
special packages.
Contact us at info@rmtltd.ru
Information furnished by RMT Ltd is believed to be reliable. However no
responsibility is assumed for possible inaccuracies or omission.
Specifications are subject to change without notice. |
