TO3 PACKAGE OPTIMAL SOLUTIONS
 |
DESCRIPTIONS
 |
The diamond-like
package is often used in laser applications |
|
The base material
is CRS (cold rolled steel) or CuW (CuMo) |
|
Gold plating as
usual |
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The number of pins is up to 8 (usually 6 or 8).
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SOLUTIONS WITH
TE MODULES
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The surface open
for TEC mounting is 8 x 8 or 8 x 12 mm2
|
|
Solutions with
powerful single-stage and multistage TE modules |
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The Series of TO3 Package Sub-Mounts
consists of the following types with single and multi-stage TE modules
SPECIFICATIONS
| TO3 |
Mounted TEC Type |
DTmax
K |
Qmax
W |
Imax
A |
Umax
V |
Rt
K/W |
A
mm |
B
mm |
H
mm |
Datasheet |
Note: Specifications are given at the package hot side temperature Thot=300K. The environment in the package is vacuum.
[ Up ]
[ with
Single-Stage TE Modules
] [ with Two-Stage
TE Modules ] [
with Three-Stage TE Modules
]
TYPICAL PACKAGES
|
TO3 header with 8 pins
|
TO3 header with 8 pins
and welding ring
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TO3 header with 8 pins
|
Please contact
RMT if you need other option of the package.
info@rmtltd.ru
|
OPTIONS
|
A. |
|
D. |
|
G. |
Thermistor (optional)
|
|
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CRS (cold rolled steel) or CuW (CuMo) |
|
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Soldering SnSb, Tmelt=230°C |
|
1.RMT’s TB Type NTC Thermistor |
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B. |
|
F. |
|
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2.Resistance nominal on request |
|
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1.Gold plating |
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1.Clear ceramics |
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3.Individual
calibration is available in the range (-65..+85°C) |
|
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2.Ni plating |
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2.Metallized |
|
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C. |
|
|
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2.1 Ni / Sn(Bi) |
H. |
|
|
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1.Soldering |
|
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2.2 Gold plating |
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Epoxy gluing |
|
|
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1.1 SnIn,Tmelt=117°C |
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3.Metallized and pre-tinned |
I. |
Thermistor Leads Connection
|
|
|
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1.2 SnBi,Tmelt=138°C |
|
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3.1 PbSnBi, Tmelt=94°C |
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Soldering SnSb, Tmelt=230°C |
|
|
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1.3 PbSn,Tmelt=183°C |
|
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3.2 InSn, Tmelt=117°C |
|
|
|
|
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1.4 SnZn,Tmelt=199°C |
|
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3.3 SnBi,Tmelt=138°C |
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|
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2.Epoxy gluing |
|
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3.4 PbSn, Tmelt=183°C |
|
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At the page you see only samples of optimal
solutions.
On custom demands we advise solutions for various optional and
special packages.
Contact us at info@rmtltd.ru
Information furnished by RMT Ltd is believed to be reliable. However no
responsibility is assumed for possible inaccuracies or omission.
Specifications are subject to change without notice. |
