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The package is
promising for Telecom applications |
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Walls
can be ceramic or metal. The base material can be CRS,
CuW, CuMo or ceramics (Alumina or Aluminum Nitride) |
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Gold plating is
usual |
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The number of
pins is usually 8 (double-side) |
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Solutions with
miniature single-stage TE modules are possible |
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The sub-mount
base thermal resistance is relatively small |
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The mounting
methods are soldering or gluing |
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The Series of miniDIL Package Sub-Mounts
consists of the following types with single stage TE modules.
| miniDIL |
Mounted TEC Type |
DTmax
K |
Qmax
W |
Imax
A |
Umax
V |
Rt
K/W |
A
mm |
B
mm |
H
mm |
Datasheet |
Note: Specifications are given at the package hot side temperature Thot=300K. The environment in the package is vacuum.
[
Up ]
MiniDIL package with 8 pins, ceramic-to-metal style
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Please contact
RMT if you need other option of the package.
info@rmtltd.ru
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A. |
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D. |
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G. |
Thermistor (optional)
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Base: CRS, CuW, CuMo or ceramics (Alumina
or Aluminum Nitride) |
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Soldering SnSb, Tmelt=230°C |
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1.RMT’s TB Type NTC Thermistor |
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B. |
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F. |
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2.Resistance nominal on request |
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1.Gold plating |
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1.Clear ceramics |
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3.Individual
calibration is available in the range (-65..+85°C) |
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2.Ni plating |
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2.Metallized |
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C. |
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2.1 Ni / Sn(Bi) |
H. |
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1.Soldering |
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2.2 Gold plating |
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Epoxy gluing |
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1.1 SnIn,Tmelt=117°C |
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3.Metallized and pre-tinned |
I. |
Thermistor Leads Connection
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1.2 SnBi,Tmelt=138°C |
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3.1 PbSnBi, Tmelt=94°C |
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Soldering SnSb, Tmelt=230°C |
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1.3 PbSn,Tmelt=183°C |
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3.2 InSn, Tmelt=117°C |
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1.4 SnZn,Tmelt=199°C |
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3.3 SnBi,Tmelt=138°C |
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2.Epoxy gluing |
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3.4 PbSn, Tmelt=183°C |
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At the page you see only samples of optimal
solutions.
On custom demands we advise solutions for various optional and
special packages.
Contact us at info@rmtltd.ru
Information furnished by RMT Ltd is believed to be reliable. However no
responsibility is assumed for possible inaccuracies or omission.
Specifications are subject to change without notice. |
