HHL PACKAGE OPTIMAL SOLUTIONS
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DESCRIPTIONS
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The
special box-like High Heat Load (HHL) package. |
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The
base material can be various: Kovar, CRS, CuW, CuMo |
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Gold
or Nickel plating is available |
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The
number of pins is usual - 9 (one-side) |
SOLUTIONS WITH
TE MODULES
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The
header surface open for mounting is about 25 x 25 mm2 |
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Complex designs with one or two TE modules are available |
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Solutions
with large powerful TE modules are possible |
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The Series of HHL Package thermoelectric Sub-Mounts
consists of the following types with single and two-stage TE modules
SPECIFICATIONS
| HHL |
Mounted TEC Type |
DTmax
K |
Qmax
W |
Imax
A |
Umax
V |
Rt
K/W |
A
mm |
B
mm |
H
mm |
Datasheet |
Note: Specifications are given at the package hot side temperature Thot=300K. The environment in the package is vacuum.
[ Up ]
TYPICAL PACKAGES
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HHL package with 9 pins
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HHL package with 9 pins with side pigtale
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Please contact
RMT if you need other option of the package.
info@rmtltd.ru
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OPTIONS
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A. |
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D. |
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G. |
Thermistor (optional)
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Base: Kovar, CRS, CuW, CuMo |
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Soldering SnSb, Tmelt=230°C |
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1.RMT’s TB Type NTC Thermistor |
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B. |
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F. |
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2.Resistance nominal on request |
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1.Gold plating |
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1.Clear ceramics |
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3.Individual
calibration is available in the range (-65..+85°C) |
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2.Ni plating |
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2.Metallized |
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C. |
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2.1 Ni / Sn(Bi) |
H. |
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1.Soldering |
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2.2 Gold plating |
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Epoxy gluing |
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1.1 SnIn,Tmelt=117°C |
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3.Metallized and pre-tinned |
I. |
Thermistor Leads Connection
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1.2 SnBi,Tmelt=138°C |
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3.1 PbSnBi, Tmelt=94°C |
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Soldering SnSb, Tmelt=230°C |
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1.3 PbSn,Tmelt=183°C |
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3.2 InSn, Tmelt=117°C |
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1.4 SnZn,Tmelt=199°C |
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3.3 SnBi,Tmelt=138°C |
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2.Epoxy gluing |
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3.4 PbSn, Tmelt=183°C |
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At the page you see only samples of optimal
solutions.
On custom demands we advise solutions for various optional and
special packages.
Contact us at info@rmtltd.ru |
