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ISO 9001:2008

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CCD PACKAGE OPTIMAL SOLUTIONS

DESCRIPTIONS  
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The package is flat, specialized for array detector applications

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The base material can be Kovar or cold rolled steel (CRS)

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Gold or Nickel plating

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The number of pins is customized (usually 28 pins)

SOLUTIONS WITH TE MODULES  
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The package surface open for mounting is about 33 x 17 mm2

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Solutions with quite large powerful TE modules are possible

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Array detector applications are involved

The Series of PS28 Package Sub-Mounts consists of the following types with single and multi-stage TE modules

SPECIFICATIONS

PS28 Mounted TEC Type DTmax
 K
Qmax
 W
Imax
 A
Umax
 V
Rt
 K/W
A
mm
B
mm
H
mm
Datasheet

Note:  Specifications are given at the package hot side temperature Thot=300K. The environment in the package is vacuum.

[ Up ] [ with Single-Stage TE Modules ] [ with Two-Stage TE Modules ]

TYPICAL PACKAGES


PS28 package (28 pins)

Please contact RMT if you need other option of the package.

info@rmtltd.ru

OPTIONS

A.

Header material 

D.

TEC Leads Connection

G.

Thermistor (optional)

Kovar, CRS

Soldering SnSb, Tmelt=230°C

1.RMT’s TB Type NTC Thermistor        

B.

Header finish

F.

TEC Cold Side Finish

2.Resistance nominal on request

1.Gold plating

1.Clear ceramics

3.Individual calibration is available in the range (-65..+85°C) 

2.Ni plating

2.Metallized

C.

TEC Mounting 

2.1 Ni / Sn(Bi)

H.

Thermistor Mounting

1.Soldering

2.2 Gold plating

Epoxy gluing

1.1 SnIn,Tmelt=117°C

3.Metallized and pre-tinned

I.

Thermistor Leads Connection

1.2 SnBi,Tmelt=138°C

3.1 PbSnBi, Tmelt=94°C

Soldering SnSb, Tmelt=230°C

1.3 PbSn,Tmelt=183°C

3.2 InSn, Tmelt=117°C

1.4 SnZn,Tmelt=199°C

3.3 SnBi,Tmelt=138°C

2.Epoxy gluing

3.4 PbSn, Tmelt=183°C

At the page you see only samples of optimal solutions.
On custom demands we advise solutions for various optional and special packages. 
Contact us at info@rmtltd.ru

Information furnished by RMT Ltd is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change without notice.

 
 

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Last Updated:  Thursday, May 06, 2010

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