Thermoelectric Cooling Solutions

site map eng | ru

Thermoelectric coolers

Print version

Standard Options

A range of standard options of RMT TE Modules is available:


On customer demand thin film conductive patterns can be printed directly onto the TEC cold side. Applications - direct mounting of laser, CCD, photodetector chips on TE module cold side surface. Typical plating:

  • Gold plating, provided for wire bonding.
  • Ni/Sn plating for solderability


Mounting of miniature NTC thermistors or other type thermosensors to a TEC cold side is available on request. RMT recommends miniature glass-beaded thermistors for this use.

A range of thermistors is available (resistance nominal, TCR, dimensions). Mounting method is thermoconductive epoxy gluing to the cold side lateral surface or demanded placement.


All standard TECs are produced in accordance with the requirements of RoHS (Directive 2002/95/EC on restriction of the use of certain hazardous substances in electrical and electronic equipment). RMT standard TECs do not contain restricted substances. They are Lead-Free and are marked correspondingly.

Ordering of «noncompliant» TECs must be specified by customer.

Standard OptionStandard Option