Thermoelectric Cooling Solutions

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Thermoelectric coolers

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1ML06 Series for Telecom Applications

MC04

The ML06 Series is RMT base Series for telecom applications. The Series consists of single-stage thermoelectric coolers with classical telecom shapes. MC06 Series is developed specially for tunable laser diodes in industry standard “Butterfly“ package form factor. Thermoelectric coolers are available on standard 0.5mm ceramics (Al2O3 or AlN) and thin 0.25mm ceramics.

All MC06 thermoelectric coolers are RoHS compliant and qualified by Telcordia GR-468 standard. RMT improved thermoelectric material provides high performance and low power consumption in final application. The ML06 Series has been specially designed for cooling and thermostabilization of laser diodes in telecom applications. Solutions on AlN ceramics are recommended for direct mounting of LD on TEC cold ceramics.

Thermoelectric coolers from ML06 Series are based on RMT regular assembly technology with up to 18W/cm2 cooling power density. Thermoelectric coolers may have regular wires or WB terminal connection type. MC06 Series TECs are manufactured on Al2O3 and AlN ceramics. RMT Ltd provide a wide range of manufacturing options for the most optimal integrating into final application. The table below contains all standard thermoelectric coolers from ML06 Series with performance values specified at +27ºC Vacuum and +50ºC Dry N2 conditions.

Thermoelectric coolers ML06 Series
TECs on Al2O3 0.5mm
TECs on Al2O3 0.25mm
TECs on AlN 0.5mm
TECs on AlN 0.25mm
Performance table at 27C, vacuum.
Performance table at 50C, N2.

Specifications


Important Note: ML06 Series TECs can be manufactured on standard 0.5mm and thin 0.25mm ceramics. This adds an additional flexibility to performance and height optimization in a particular application. It is also possible to combine various ceramics thicknesses to achieve the most optimal results for TEC height, performance and power consumption. Mind, please, that with different ceramics thickness TECs may have different performance having the same geometry. Here is the example (please, click to zoom in):

Click to enlarge.

Please, use On-Line Assistant to find the most optimal thermoelectric cooler by dimensions and performance parameters. The detailed analysis of TEC performance and power consumption can be made with free TECCad software for Windows or special iTECPad app for iPad (available free on App Store).


Options

  1. TEC Assempling
    1. Solder SnSb (Tmelt=230°C)
    2. Solder AuSn (Tmelt=280°C)
  2. Ceramics
    1. Pure Al2O3 (100%)
    2. Alumina Al2O3 (96%)
    3. Aluminum Nitride (AIN)
  1. Surface finish
    1. Blank ceramics (not metallized)
    2. Metallized (Au plating)
    3. Metallized and pre-tinned with:
      1. Solder 117 (InSn, Tmelt=117°C)
      2. Solder 138 (SnBi, Tmelt=138°C)
      3. Solder 143 (In-Ag, Tmelt=143°C)
      4. Solder 157 (In, Tmelt=157°C)
      5. Solder 183 (PbSn, Tmelt=183°C)
      6. Optional (specified by Customer)
  1. Thermosensor (optional)
    • Can be mounted to cold side ceramics edge. Calibration is available by request.
  2. Terminal contacts:
    1. Blank, tinned Copper
    2. Insulated Wires
    3. Insulated, color coded

Information furnished by RMT Ltd is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change whithout notice.