Thermoelectric Cooling Solutions

MD10 Series


The MD10 Series is the expansion for standard MC10 Series TECs. MD10 Series consist of single-stage thermoelectric coolers based on high-density pellets placement. Most of MD10 single-stage TECs are the analogs of standard MC10 TECs by dimensions, but have the increased cooling capacity. RMT High-density pellets placement technology allows to place more BiTe posts on the same size as regular TECs have. More internal elements means higher cooling capacity, which is up to 60% higher with MD10 Series TECs comparing with regular types. Al2O3 ceramics is applied by default, AlN ceramics is available as an option.
All MD10 thermoelectric coolers are RoHS compliant and qualified by Telcordia GR-468 standard.
MD10 TECs were developed by RMT additionally to general thermoelectric coolers series. MD10 thermoelectric coolers can be used in applications with high heatload and provide higher dT, where regular types may have less efficiency. RMT MD10 TECs are common solution for applications with HHL and BTF packages form-factor.

Click to enlarge. Click to enlarge.
Fig 1 - Standard 15x15mm2 TEC from MC10 (left)
and it’s analog from MD10 Series with 65% higher Qmax
Fig 2 - The difference in performance parameters
between MC10 and MD10 TECs (click to zoom)

Thermoelectric coolers MD10 Series
Performance table at 27C, vacuum.
Performance table at 50C, N2.


Important Note: MD10 Series TECs can be manufactured on standard 0.5mm and thick 1.0mm ceramics. This adds an additional flexibility to performance and height optimization in a particular application. It is also possible to combine various ceramics thicknesses to achieve the most optimal results for TEC height.

Please, use On-Line Assistant to find the most optimal thermoelectric cooler by dimensions and performance parameters. The detailed analysis of TEC performance and power consumption can be made with free TECCad software for Windows or special iTECPad app for iPad (available free on App Store).


  1. TEC Assempling
    1. Solder SnSb (Tmelt=230°C)
    2. Solder AuSn (Tmelt=280°C)
  2. Ceramics
    1. Pure Al2O3 (100%)
    2. Alumina Al2O3 (96%)
    3. Aluminum Nitride (AIN)
  1. Surface finish
    1. Blank ceramics (not metallized)
    2. Metallized (Au plating)
    3. Metallized and pre-tinned with:
      1. Solder 117 (InSn, Tmelt=117°C)
      2. Solder 138 (SnBi, Tmelt=138°C)
      3. Solder 143 (In-Ag, Tmelt=143°C)
      4. Solder 157 (In, Tmelt=157°C)
      5. Solder 183 (PbSn, Tmelt=183°C)
      6. Optional (specified by Customer)
  1. Thermosensor (optional)
    • Can be mounted to cold side ceramics edge. Calibration is available by request.
  2. Terminal contacts:
    1. Blank, tinned Copper
    2. Insulated Wires
    3. Insulated, color coded

Information furnished by RMT Ltd is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change whithout notice.