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Thermoelectronic Modules

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MD06 Series of Single & Multistage TE Modules

MD06

The feature of this series of miniature TE modules is an increased cooling capacity (up to 25 W/cm2). Modules of the series are suitable for applications where it is required to remove heat from miniature objects with high power dissipation.

The MD06 is sub-series of the large MD series of TE micro-modules. It consists of miniature TECs from single- to multistage types (1MD06, 2MD06 and 3&4MD06).

The MD06 series has been designed for cooling and thermostabilization of optoelectronic devices, IR instruments and microelectronic components.

Optional design of MD06 type mini-TECs is available on request.

3 & 4MD06 Multistage Modules

New! The 3MD06 & 4MD06 sub-series of multistage TE modules consists of the following types:

3MD06-071 3MD06-113 3MD06-155
4MD06-116 4MD06-160  

Specifications

3 & 4MD06 Type DTmax
K
Qmax
W
Imax
A
Umax
V
AC R
Ohm
H
mm
A
mm
B
mm
C
mm
D
mm
Data Sheet
3MD06-071-xx (N=6+17+48)
3MD06-071-05 113 1.66 2.30 5.65 1.99 3.8 3.4 3.4 8.2 8.2 3MD06071
3MD06-071-08 115 1.08 1.50 3.09 4.7
3MD06-071-10 115 0.88 1.20 3.83 5.3
3MD06-071-12 116 0.74 1.00 4.57 5.9
3MD06-071-15 116 0.60 0.81 5.67 6.8
3MD06-113-xx (N=12+31+70)
3MD06-113-05 108 3.00 2.15 8.35 3.17 3.8 4.2 4.2 9.8 9.8 3MD06113
3MD06-113-08 111 1.97 1.20 4.93 4.7
3MD06-113-10 111 1.60 1.10 6.11 5.3
3MD06-113-12 112 1.35 0.95 7.29 5.9
3MD06-113-15 112 1.09 0.75 9.05 6.8
3MD06-155-xx (N=18+41+96)
3MD06-155-05 107 4.29 2.10 11.3 4.33 3.8 5.0 5.0 11.4 11.4 3MD06155
3MD06-155-08 110 2.81 1.35 6.73 4.7
3MD06-155-10 110 2.29 1.10 8.35 5.3
3MD06-155-12 111 1.93 0.95 9.95 5.9
3MD06-155-15 111 1.56 0.75 12.4 6.8
4MD06-116-xx (N=4+11+31+70)
4MD06-116-05 123 1.18 2.10 8.25 3.22 4.9 4.2 4.2 9.8 9.8 4MD06116
4MD06-116-08 125 0.77 1.35 5.01 6.1
4MD06-116-10 126 0.62 1.10 6.20 6.9
4MD06-116-12 126 0.52 0.90 7.39 7.7
4MD06-116-15 126 0.42 0.75 9.20 8.9
4MD06-160-xx (N=6+17+41+96)
4MD06-160-05 122 1.74 2.05 11.2 4.43 4.9 4.2 4.2 11.4 11.4 4MD06160
4MD06-160-08 124 1.13 1.35 6.88 6.1
4MD06-160-10 125 0.92 1.10 8.53 6.9
4MD06-160-12 125 0.77 0.90 10.18 7.7
4MD06-160-15 125 0.62 0.75 12.6 8.9

Note: Performance data shown in specifications are given for Th=300 K, vacuum.

Options

  1. TEC Assempling
    1. Solder SNSb (Tmelt=230°C)
    2. Solder PbSn (Tmelt=183°C)
  2. Ceramics
    1. Pure Alumnia 100%
    2. Alumina 96%
    3. Aluminum Nitride (AIN)
  1. Surface finish
    1. Clear ceramics
    2. Metallized Ni (Ni/Sn(Bi))
    3. Metallized Au
  2. Pretinning
    1. Rose alloy (PbSnBi, Tmelt=94°C)
    2. Solder 117 (InSn, Tmelt=117°C)
    3. Solder 138 (SnBi, Tmelt=138°C)
    4. Solder 157 (In, Tmelt=157°C)
    5. Solder 183 (PbSn, Tmelt=183°C)
    6. Solder 199 (SnZn, Tmelt=199°C)
  1. Protective coating
    1. Parylene coating (10-15 mm thickness)
  1. Thermosensor
    1. NTC Glass beaded

Information furnished by RMT Ltd is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change whithout notice.