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Thermoelectronic Modules

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MD04 Series of Single & Multistage TE Modules

MD04

The feature of this series of miniature TE modules is an increased cooling capacity (up to 25 W/cm2). Modules of the series are suitable for applications where it is required to remove heat from miniature objects with high power dissipation.

The MD04 is sub-series of the large MD series of TE micro-modules. It consists of miniature TECs from single- to multistage types (1MD04, 2MD04 and 3&4MD04).

The MD04 series has been designed for cooling and thermostabilization of optoelectronic devices, IR instruments and microelectronic components.

Optional design of MD04 type mini-TECs is available on request.

3 & 4MD04 Multistage Modules

New! The 3MD04 & 4MD04 sub-series of multistage TE modules consists of the following types:

3MD04-071 3MD04-113 3MD04-155
4MD04-116 4MD04-160  

Specifications

3 & 4MD04 Type DTmax
K
Qmax
W
Imax
A
Umax
V
AC R
Ohm
H
mm
A
mm
B
mm
C
mm
D
mm
Data Sheet
3MD04-071-xx (N=6+17+48)
3MD04-071-05 114 0.77 1.10 5.70 4.35 3.8 2.6 2.6 6.2 6.2 3MD04071
3MD04-071-08 116 0.49 0.70 6.84 4.7
3MD04-071-10 116 0.40 0.55 8.50 5.3
3MD04-071-12 116 0.33 0.45 10.1 5.9
3MD04-071-15 116 0.27 0.40 12.8 6.8
3MD04-113-xx (N=12+31+70)
3MD04-113-05 110 1.39 1.00 8.40 6.94 3.8 3.2 3.2 7.4 7.4 3MD04113
3MD04-113-08 112 0.90 0.65 10.9 4.7
3MD04-113-10 112 0.73 0.50 13.9 5.3
3MD04-113-12 112 0.61 0.42 16.2 5.9
3MD04-113-15 112 0.49 0.34 20.2 6.8
3MD04-155-xx (N=18+41+96)
3MD04-155-05 109 1.98 1.00 11.4 9.5 3.8 3.8 3.8 8.6 8.6 3MD04155
3MD04-155-08 110 1.28 0.60 14.9 4.7
3MD04-155-10 111 1.04 0.50 18.6 5.3
3MD04-155-12 111 0.87 0.42 22.2 5.9
3MD04-155-15 111 0.70 0.34 27.7 6.8
4MD04-116-xx (N=4+11+31+70)
4MD04-116-05 125 0.54 0.95 8.25 7.04 4.9 2.6 2.6 7.4 7.4 4MD04116
4MD04-116-08 126 0.35 0.60 11.1 6.1
4MD04-116-10 126 0.28 0.50 13.7 6.9
4MD04-116-12 126 0.23 0.40 16.4 7.7
4MD04-116-15 126 0.19 0.35 20.4 8.9
4MD04-160-xx (N=6+17+41+96)
4MD04-160-05 124 0.80 0.95 11.2 9.69 4.9 2.6 2.6 8.6 8.6 4MD04160
4MD04-160-08 125 0.51 0.60 15.2 6.1
4MD04-160-10 125 0.41 0.50 18.9 6.9
4MD04-160-12 125 0.35 0.40 22.7 7.7
4MD04-160-15 125 0.28 0.35 28.2 8.9

Note: Performance data shown in specifications are given for Th=300 K, vacuum.

Options

  1. TEC Assempling
    1. Solder SNSb (Tmelt=230°C)
    2. Solder PbSn (Tmelt=183°C)
  2. Ceramics
    1. Pure Alumnia 100%
    2. Alumina 96%
    3. Aluminum Nitride (AIN)
  1. Surface finish
    1. Clear ceramics
    2. Metallized Ni (Ni/Sn(Bi))
    3. Metallized Au
  2. Pretinning
    1. Rose alloy (PbSnBi, Tmelt=94°C)
    2. Solder 117 (InSn, Tmelt=117°C)
    3. Solder 138 (SnBi, Tmelt=138°C)
    4. Solder 157 (In, Tmelt=157°C)
    5. Solder 183 (PbSn, Tmelt=183°C)
    6. Solder 199 (SnZn, Tmelt=199°C)
  1. Protective coating
    1. Parylene coating (10-15 mm thickness)
  1. Thermosensor
    1. NTC Glass beaded

Information furnished by RMT Ltd is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change whithout notice.