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Thermoelectronic Modules

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MC04 Series of Single & Multistage TE Modules

MC04

The MC04 is sub-series of the large MC series of TE micro-modules. It consists of miniature TECs from single- to multistage types (1MC04, 2MC04 and 3&4MC04).

The MC04 series has been designed for cooling and thermostabilization of optoelectronic devices, IR instruments and microelectronic components.

Optional design of MC04 type mini-TECs is available on request.

3 & 4MC04 Single stage Modules

The 3MC04 & 4MC04 sub-series of multistage TE modules consists of the following types:

3MC04-044 (Option 1 of 3MC04-046) 3MC04-076 4MC04-115
3MC04-046 3MC04-112  

Specifications

3 & 4MC04 Type DTmax
K
Qmax
W
Imax
A
Umax
V
AC R
Ohm
H
mm
A
mm
B
mm
C
mm
D
mm
Data Sheet
Option 1 3MC04-044-xx (N=4+11+29)
3MC04-044-05 112 0.53 1.0 3.50 2.85 3.8 2.4 2.4 6.4 6.4 3MC04044
3MC04-044-08 114 0.37 0.7 4.55 4.7
3MC04-044-10 114 0.27 0.6 5.65 5.3
3MC04-044-12 115 0.23 0.5 6.80 5.9
3MC04-044-15 115 0.18 0.4 8.45 6.8
Standart 3MC04-046-xx (N=4+11+31)(Option1 - type 1MC04-044-xx, hot side 6.4x6.4 mm)
3MC04-046-05 114 0.52 1.1 3.70 2.99 3.8 4.0 4.0 8.0 6.4 3MC04046
3MC04-046-08 115 0.33 0.7 4.75 4.7
3MC04-046-10 115 0.27 0.6 5.91 5.3
3MC04-046-12 115 0.23 0.5 7.08 5.9
3MC04-046-15 115 0.18 0.4 8.84 6.8
Option 1 3MC04-076-xx (N=8+21+47)
3MC04-076-05 110 0.97 1.0 5.70 4.95 3.8 4.0 4.0 8.0 8.0 3MC04076
3MC04-076-08 111 0.62 0.7 7.84 4.7
3MC04-076-10 111 0.50 0.5 9.77 5.3
3MC04-076-12 111 0.42 0.5 11.7 5.9
3MC04-076-15 110 0.33 0.4 14.6 6.8
Option 1 3MC04-112-xx (N=12+31+69)
3MC04-112-05 109 1.45 1.0 8.30 7.30 3.8 3.2 4.8 9.6 9.6 3MC04112
3MC04-112-08 110 0.94 0.7 11.6 4.7
3MC04-112-10 111 0.75 0.5 14.4 5.3
3MC04-112-12 111 0.63 0.5 17.2 5.9
3MC04-112-15 112 0.51 0.4 21.5 6.8
Option 1 4MC04-115-xx (N=4+11+31+69)
4MC04-115-05 124 0.58 1.0 8.20 7.50 4.9 2.4 2.4 9.6 9.6 4MC04115
4MC04-115-08 125 0.37 0.6 11.9 6.1
4MC04-115-10 126 0.30 0.5 14.8 6.9
4MC04-115-12 126 0.25 0.4 17.7 7.7
4MC04-115-15 127 0.20 0.4 22.1 8.9

Note: Performance data shown in specifications are given for Th=300 K, vacuum.

Options

  1. TEC Assempling
    1. Solder SNSb (Tmelt=230°C)
    2. Solder PbSn (Tmelt=183°C)
  2. Ceramics
    1. Pure Alumnia 100%
    2. Alumina 96%
    3. Aluminum Nitride (AIN)
  1. Surface finish
    1. Clear ceramics
    2. Metallized Ni (Ni/Sn(Bi))
    3. Metallized Au
  2. Pretinning
    1. Rose alloy (PbSnBi, Tmelt=94°C)
    2. Solder 117 (InSn, Tmelt=117°C)
    3. Solder 138 (SnBi, Tmelt=138°C)
    4. Solder 157 (In, Tmelt=157°C)
    5. Solder 183 (PbSn, Tmelt=183°C)
    6. Solder 199 (SnZn, Tmelt=199°C)
  1. Protective coating
    1. Parylene coating (10-15 mm thickness)
  1. Thermosensor
    1. NTC Glass beaded

Information furnished by RMT Ltd is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change whithout notice.