MDD03 SERIES OF SINGLE-STAGE TECS

Introducing the most popular TE coolers for telecom applications. Due to its compactness and power density, they are suitable for 10G, 25G, 50G, 100G and other powerful cases.

High power density (up to 27 W/cm²) leads to unsurpassed efficiency at cooling small objects such as laser diodes. Their typical footprint of 2x2 mm²…3x5 mm² makes them fit in the TOSA and TO packages.


Size comparison of 1MDD03-008-04, 1MDD03-016-04/1 and 1MDD03-038-04	Typical VCSEL TO46 sub-mount with 1MDD03-007-05

SPECIFICATIONS

Exterior	Type	ΔTmax K	Qmax W	Imax A	Umax V	ACR Ohm	H mm	A mm	B mm	C mm	D mm	Data Sheet
	1MDD03-008-04/Z3/PA	74	0.69	1.19	0.98	0.66	0.9	1.6	1.6	1.6	2.2
	1MDD03-012-04/1/Z3/PA	74	1.03	1.19	1.47	0.99	0.9	2.0	2.0	2.0	2.7
	1MDD03-013-04/1/Z3/PO	75	0.90	0.96	1.60	1.33	1.1	2.2	2.6	2.2	3.3
	1MDD03-016-04/1/Z3/PO	74	1.36	1.19	1.97	1.31	1.45	1.7	3.2	1.7	4.0
	1MDD03-024-04/2/Z3/PO	74	2.03	1.18	2.93	1.97	1.45	2.4	3.2	2.4	4.0
	1MDD03-038-04/Z3/PO	74	3.25	1.19	4.66	3.12	1.0	2.8	4.5	2.8	5.1

Important Note: MDD03 Series TECs are manufactured by default on 0.25 mm thickness AlN ceramics. There are also 0.15, 0.38 and 0.5 mm ceramics as a solution. This adds an additional flexibility to performance and height optimization in a particular application. It is also possible to combine various ceramics thicknesses to achieve the most optimal results for TEC height.

Please, use On-Line Assistant to find the most optimal thermoelectric cooler by dimensions and performance parameters. The detailed analysis of TEC performance and power consumption can be made with free TECCad software for Windows.

• Definition and Notes

• Perfomance Plots

• How to Select ...

• Standart Options

OPTIONS

A. TEC Assembly Solder
1. Lead-free Solder Sn-Sb (Tmelt =230ºC) – default
2. Lead-free Solder Au-Sn (Tmelt = 280ºC) available by request

B. Ceramics

1.     Aluminum Nitride (AIN) - default
2.     Al₂O₃ 100%
3.     Mixed solution (AlN/Al₂O₃)

C. Surface finish

1. Blank ceramics (not metallized)
2. Metallized (Au plating)

D. Thermistor (optional)

Can be mounted to TEC cold side. Calibration is available by request. Various thermistor solutions are available

E. TEC Terminal contacts:

1. WB pads or WB posts
2. Flip-Chip Terminal Solution

Information furnished by RMT Ltd. is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change without notice.